20 September 2026

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India Semiconductor Mission 2.0

Why in news

  • SEMICON India 2026 concluded in New Delhi with the announcement of India Semiconductor Mission (ISM) 2.0.

Key terms

Advanced Packaging

An aggregation method combining multiple semiconductor chips into a single integrated package to improve performance.

What is the India Semiconductor Mission?

  • Launched under the Digital India Corporation to build a sustainable semiconductor and display ecosystem.
  • Semicon 1.0 approved 12 commercial projects, with five units currently operational including facilities at CDIL Mohali and Suchi Semicon Surat.

Key features of Semicon 2.0

  • Financial outlay increased to ₹1,27,500 crore to expand capabilities across the value chain.
  • Structured around six core pillars: design, equipment & materials, new fabrication units, advanced packaging, research, and talent development.

Why it matters

  • Transitions India from project planning and assembly to full domestic commercial semiconductor manufacturing and supply chain resilience.

Prelims facts

  • Semicon 2.0 covers six pillars including design, packaging, and raw materials.

Mains discussion

  • Strategic significance of domestic semiconductor manufacturing for supply chain sovereignty.

Source: PIB

समान विषय · पिछले पेपर

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  1. 2026 · Q83 · General Studies · 2 marks

    Which one of the following pairs of semiconductor plants in India and their locations is NOT correctly matched?

    उत्तर देखें →

  2. 2025 · Q16 · GS III · 15 marks

    India aims to become a semiconductor manufacturing hub. What are the challenges faced by the semiconductor industry in India? Mention the salient features of the India Semiconductor Mission.

    उत्तर देखें →

← All Prelims + Mains notes for 20 September 2026

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