A
A method of securing silicon wafers in shock-proof cardboard boxes during transport.
B
An aggregation method combining multiple semiconductor chips into a single integrated package to improve performance.
C
A regulatory framework for eco-friendly disposal of electronic waste.
D
A branding technique used for retail marketing of microprocessor units.
Correct answer: (b) An aggregation method combining multiple semiconductor chips into a single integrated package to improve performance.
Explanation
Option B is correct because advanced packaging refers to combining multiple semiconductor chips into a single integrated package to enhance performance. Options A, C, and D are incorrect distractors.
Same topic · past papers
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