A
Assembly, Testing, Marking, and Packaging / Outsourced Semiconductor Assembly and Test units that convert silicon wafers into finished chips.
B
Advanced Tooling and Manufacturing Plants designed exclusively for raw silicon extraction.
C
Automated Transport and Marketing Platforms used for global export logistics of microchips.
D
Algorithmic Design and Testing Protocols used to check software bugs in operating systems.
Correct answer: (a) Assembly, Testing, Marking, and Packaging / Outsourced Semiconductor Assembly and Test units that convert silicon wafers into finished chips.
Explanation
Option A is correct as ATMP and OSAT stand for Assembly, Testing, Marking, and Packaging / Outsourced Semiconductor Assembly and Test units which process silicon wafers into final chips. The other options use incorrect definitions.
समान विषय · पिछले पेपर
UPSC ने यह पहले भी पूछा है
ये पिछले वर्षों के प्रश्न उसी विषय पर हैं। अभ्यास के लिए खोलें।
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