A
Extraction and purification of raw metallurgical-grade silicon from quartz mines
B
Assembly, Testing, Marking, and Packaging facilities that turn silicon wafers into finished chips
C
Fabrication of lithographic masks using extreme ultraviolet photolithography
D
Development of open-source instruction set architectures for microprocessors
Correct answer: (b) Assembly, Testing, Marking, and Packaging facilities that turn silicon wafers into finished chips
Explanation
Option B correctly defines Outsourced Semiconductor Assembly and Testing (OSAT) or Assembly, Testing, Marking, and Packaging (ATMP) facilities. The other options describe upstream mining, mask-making, or processor design.
समान विषय · पिछले पेपर
UPSC ने यह पहले भी पूछा है
ये पिछले वर्षों के प्रश्न उसी विषय पर हैं। अभ्यास के लिए खोलें।
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2018 · Q64 · UPPGS
निम्नलिखित तत्वों में कौन अर्धचालक है ?