Q8 · UPPSC current affairs · 20 September 2026 · PIB · India Semiconductor Mission 2.0

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What does 'Advanced Packaging' signify in the semiconductor manufacturing sector?

A A method of securing silicon wafers in shock-proof cardboard boxes during transport.
B An aggregation method combining multiple semiconductor chips into a single integrated package to improve performance.
C A regulatory framework for eco-friendly disposal of electronic waste.
D A branding technique used for retail marketing of microprocessor units.

Correct answer: (b) An aggregation method combining multiple semiconductor chips into a single integrated package to improve performance.

Explanation

Option B is correct because advanced packaging refers to combining multiple semiconductor chips into a single integrated package to enhance performance. Options A, C, and D are incorrect distractors.

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